What is PECVD coating?
Plasma enhanced chemical vapor deposition (PECVD) is a low temperature vacuum deposition process (<150 °C) that can deposit coatings and thin films of various materials onto the surface of a part.
What is PECVD used for?
Plasma enhanced chemical vapor deposition (PECVD) is used for the deposition of dielectric thin films. This process has been developed for the semiconductor industry and is extensively used in microelectronics applications.
What gases are used in PECVD?
The films typically deposited using PECVD are silicon nitride (SixNy), silicon dioxide (SiO2), silicon oxy-nitride (SiOxNy), silicon carbide (SiC), and amorphous silicon (α-Si).
How plasma is created in PECVD?
Chemical reactions are involved in the process, which occur after creation of a plasma of the reacting gases. The plasma is generally created by radio frequency (RF) (alternating current (AC)) frequency or direct current (DC) discharge between two electrodes, the space between which is filled with the reacting gases.
What is the typical high frequency used in PECVD?
Depending on the plasma excitation frequency, the PECVD process can either be radio frequency (RF)-PECVD (standard frequency of 13.56 MHz) or very high frequency (VHF)-PECVD (with frequencies up to 150 MHz).
Which depend materials are used in external CVD method?
CVD for titanium, nickel, and refractory metals, including molybdenum, tantalum, niobium, and rhenium, is widely used [17–19]. These metals can form useful silicides when deposited onto silicon.
What is the typical temperature range is required for the operation of Lpcvd and PECVD?
Both technologies are frequently utilized for thin film deposition, but differ significantly in tool configurations, with LPCVD capable of processing over 100 wafers per run at 600°C to 800°C versus PECVD, which is typically a single wafer or relatively small batch operating between 200°C to 400°C.
What is used as a base material in CVD process?
CVD for molybdenum, tantalum, titanium, nickel is widely used. These metals can form useful silicides when deposited onto silicon. Mo, Ta and Ti are deposited by LPCVD, from their pentachlorides. Nickel, molybdenum, and tungsten can be deposited at low temperatures from their carbonyl precursors.
What metal is PVD?
Our PVD coating stainless steel, with physical Vapor Deposition (PVD), is a process to produce a metal vapor (titanium, chromium, and aluminum) that can be deposited on electrically conductive materials as a thin highly adhered pure metal or alloy coating.
Which material is used for PVD coating?
Common PVD coating materials are titanium, zirconium, aluminum, stainless steel and copper, though gold for aerospace electronics is often requested. And these coatings can be applied to a wide variety of substrates, including nylon, plastics, glass, ceramics and metals, such as stainless steel and aluminum.
Which gas is used in CVD process?
Common materials prepared by CVD are silicon oxide, silicon oxide is deposited by CVD by several processes. The sources of gases used in the deposition process are silane and oxygen, dichlorosilane, and nitrous oxide.
What is the chemical used for CVD?
Can PVD be done on Aluminium?
With PVD, a wide variety of metals can be deposited including aluminum, chromium, titanium, stainless steel, nickel chrome, tin, etc.
Which metals can be PVD coated?
Almost any material can be PVD coated, but the most typical examples are using the process for stainless steel or titanium. Other materials include: chrome plated brass and all other steels.